Dimensity 7200 marks the start of MediaTek's 7000 series chipset

Mediatek launched the new Dimensity 7200 SoC that has marked the launch of Dimensity 7000 series, which is mainly focused on enhancing gaming experience and photography and will be used to power the mid-range 5G smartphones. This launch was followed by the introduction its affordable counterpart the Helio G36 SoC, by the chipmaker.

Deatils about Dimensity 7200 SoC

The Dimensity 7200 chipset utilizes TSMC’s 4nm second-generation process, also featured in the flagship Dimensity 9200 SoC. The is based on an octa-core CPU structure which includes six Cortex-A510 cores and two Arm Cortex-A715 cores, that can achieve clock speeds of up to 2.8GHz. Additionally, it features the Arm Mali-G610 MC4 GPU.

To enhance gaming performance, the chipset has MediaTek HyperEngine 5.0 technology, which utilizes AI-based Variable Rate Shading (VRS), smart resource optimization for both the CPU and GPU, and other features to save power and deliver superior gaming performance.

The SoC also incorporates the MediaTek Imagiq 765 and a 14-bit HDR-ISP to enhance photographic capabilities. With these features, the Dimensity 7200 can support cameras with up to 200MP, 4K HDR video, all-pixel autofocus technology, simultaneous video recording via both front and rear cameras, built-in Motion Compensated Noise Reduction for improved low-light photography, AI-Camera enhancements, and more.

Dimensity 7200 marks the start of MediaTek's 7000 series chipset
Image Credits: MediaTek

The chipset features Bluetooth LE Audio technology, Dual-Link True Wireless Stereo Audio for wireless earbud support, and UFS 3.1 storage. The Dimensity 7200 chipset is set to be incorporated into 5G devices globally by Q1 2023.

The Dimensity 7200 SoC can support up to Full HD+ screen resolution, HDR10+, and a 144Hz refresh rate. It is also capable of AI SDR(Standard Dynamic Range)-to-HDR(High Dynamic Range) video playback. In terms of connectivity, the chipset supports triband Wi-Fi 6E, Bluetooth 5.3, 2CC Carrier Aggregation, and Dual 5G SIM with dual VoNR(Voice over New Radio). It includes a 3GPP Release-16 standard Sub-6GHz 5G modem and is equipped with MediaTek’s 5G UltraSave 2.0 technology.

Overall, this new chip packs a lot of features which will help to boost the mid-range smartphones overall performance and their capabilities. But at present there is no proper update of the devices going to have this new SoC.

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